The miniaturization of electronic components and their use is constantly increasing :
In addition, electronic components are becoming smaller and smaller and are being housed in smaller spaces. The heat generated by electronic systems is therefore increasing, as well as the risk of damage to the components.
This trend generates needs in terms of thermal dissipation and thermal interface materials (TIM) are required.
GERGONNE offers a range of thermally conductive adhesives specifically designed to improve the reliability/longevity of electronic components and reduce their risk of failure.
Our adhesive thermal interface solutions, part of the GERGOTIM range, have a unique and innovative construction and guarantee very good thermal conductivity and electrical insulation.
Our adhesives guarantee excellent thermal management and ensure reliable heat transfer between heat-generating electronic components and cooling devices such as fans or heat sinks (radiators).
GERGOTIM thermal interface adhesive tapes are manufactured in rolls and can be cut to fit each application.
Their double-sided adhesive properties allow :