THERMAL INTERFACE MATERIALS
The integration of increasingly compact components into confined spaces leads to a significant rise in heat generation. This increase in thermal constraints heightens the risks of performance loss, premature ageing, and electronic failure.
The integration of increasingly compact components into confined spaces leads to a significant rise in heat generation. This increase in thermal constraints heightens the risks of performance loss, premature ageing, and electronic failure.
Thermal management has therefore become a key driver of reliability. The use of Thermal Interface Materials (TIM) helps optimize heat transfer, reduce thermal resistance, and extend the service life of electronic systems.
Our GERGOTIM range meets the growing demands of manufacturers in terms of thermal management. These TIM solutions are specifically designed to:
- improve the reliability of electronic components
- extend their lifespan
- limit overheating risks
- reduce premature failures
- secure critical applications (automotive, embedded electronics, industrial equipment)
GERGOTIM: TSI silicone thermal pads
Our silicone thermal pads incorporate breakthrough technology that offers numerous advantages, such as a low carbon footprint and a manufacturing process suitable for large volumes etc. TSI silicone thermal pads are:
- tacky on both sides for excellent adhesion
- highly conformable and compressible, ensuring optimal contact between surfaces
- resistant to high temperatures (up to 200°C)
- formulated without silicone oil, guaranteeing no leakage and low outgassing
- available in different levels of hardness and thermal conductivity
The standard range includes the TSI-10, TSI-11, and TSI-12 references, with the possibility of custom developments according to your technical requirements. Contact us for more information.
| Product | Hardness (Shore 00) | Thermal conductivity (W/m.K) | Thickness (mm) | |
|---|---|---|---|---|
| TSI-10 | 30 | 1.5 | 1 / 1.5 / 2 / 2.5 | Technical sheet |
| TSI-11 | 70 | 1.5 | 1 / 2 | Technical sheet |
| TSI-12 | 50 | 2 | 1 / 2 | Technical sheet |
A high-performance alternative to liquid materials
Compared to liquid “gap filler” solutions, TSI thermal pads offer major industrial advantages:
– cleaner and more secure production processes
– simple and cost-effective application (manual or automated assembly)
– no drying or curing phase required
– precise control of the final assembled component thickness
GERGOTIM: HTP acrylic thermal adhesive tapes
HTP acrylic thermal adhesive tapes from the GERGOTIM range are designed to optimize the thermal management of electronic components while ensuring excellent electrical insulation.
Thanks to their innovative construction, these adhesive thermal interface solutions provide high thermal conductivity and reliable performance in demanding environments.
Our acrylic thermal conductive adhesive tapes are perfectly suited for applications requiring both:
- effective heat dissipation
- secure electrical insulation
- reliable mechanical fastening
Available in different thicknesses, they offer excellent conformability, ensuring optimal contact with 100% of the surface. The result: no air pockets, better thermal performance, and clean, precise installation.
Manufactured in rolls and cut to size, GERGOTIM HTP thermal adhesive tapes can be easily integrated into assembly processes.
Their double-sided adhesive properties allow:
- a quick and simplified assembly process
- improved thermal performance thanks to the absence of air bubbles
- a clean, stable and controlled solution in production
The HTP range includes four standard references: HTP10-180, HTP10-250, HTP10-500, and HTP10-1000.
| Product | Thickness (µm) | Thermal conductivity (W/mk) | Thermal resistance (K.cm²/W) | Electric breakdown voltage (V) | |
|---|---|---|---|---|---|
| HTP10-180 | 180 | 1.60 | 1.13 | > 5000 | Technical sheet |
| HTP10-250 | 250 | 1.60 | 1.55 | > 6000 | Technical sheet |
| HTP-500 | 500 | 1.60 | 3.10 | > 10 000 | Technical sheet |
| HTP10-1000 | 1000 | 1.60 | 6.20 | > 10 000 | Technical sheet |
Contact us for more information on our thermal interface solutions!
Frequently Asked Questions
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A thermal pad and a thermally conductive adhesive tape are both thermal management solutions for electronic components, but their mechanical functions and applications differ significantly.
Thermal pad: compressible thermal interface without bonding function
A thermal pad (such as our TSI range) is a thermally conductive material designed to ensure heat transfer between two surfaces, typically between an electronic component and a heat sink.
Key characteristics:
– Ensures heat dissipation and improves thermal contact
– Compressible and conformable
– Compensates for surface irregularities, mechanical tolerances, and thickness variations
– Provides no mechanical fastening
– Retained in place by external pressure (screws, housing, clips, clamping frame)A thermal pad is particularly recommended when:
– Surfaces exhibit irregularities
– Future disassembly is required
– Mechanical tolerance management is criticalThermally conductive adhesive tape: heat transfer + mechanical bonding
A thermally conductive adhesive tape, such as our HTP range, combines thermal conductivity with permanent mechanical bonding.Advantages:
– Provides permanent bonding of parts
– Eliminates the need for screws or clamping systems
– Excellent resistance to shock and vibration
– Suitable for demanding industrial environments
– Ideal solution where space is limited or constrainedIt is particularly used when:
– Available space is limited
– Long-term, durable fastening is required
– High vibration constraints are presentIn summary: the choice should be driven by mechanical constraints, the operating environment, vibration levels and available space.