Aktualności

Over the last few years, the electronics sector (all markets combined) didn't stop growing and facing new problematics. Nowadays, numerous electronic components have been miniaturised, however housings/devices need to fill more and more functionalities. Thus, thermal management is a major issue for electronic companies. 

In this context, we developed a large range of adhesive thermal interfaces, including our HTP-10 standard product which allows to dissipate the excess heat generated and therefore to ensure long product life cycle and an optimal long-term performance. 

HTP-10's major advantages:

• Different applications (thermal management, heat-sink thermal interfaces, LED lighting thermal management) 
• 4 standard thicknesses (180 µm, 250 µm, 500 µm and1000 µm)
• Excellent thermal dissipation combined to excellent electrical insulation 
• Silicone free
• Possibility to die-cut to the desired form and dimensions

Don't hesitate to contact us if you need to know more.