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THERMALLY CONDUCTIVE INTERFACES: our adhesive solutions for effective thermal management
Although our silicone thermal pads (TSI) and acrylic thermal adhesive tapes (HTP) ensure effective heat dissipation for your electronic components whilst providing excellent electrical insulation, they are nevertheless designed to meet a wide range of needs and applications.
Find out how to choose the ideal thermally conductive interfaces for your engineering challenges.
TSI thermal pads: flexibility and tolerance management
Placed between the electronic component and the heat sink, the silicone thermal pad ensures optimal heat transfer.
When use them? Ideal for irregular surfaces, when subsequent dismantling is required, or when managing mechanical tolerances is critical.
Key benefits:
- compressible and conformable
- ensures heat dissipation and improves thermal contact
- formulated without silicone oil, guaranteeing no leakage and low outgassing
HTP acrylic thermal tapes: mechanical bonding
The thermal adhesive tapes in our HTP line combine thermal conductivity with a permanent mechanical bond.
When use them? They are particularly suitable when space is limited, a durable bond is required, and high vibration levels may occur.
Key benefits:
- excellent resistance to shock and vibration
- ideal solution where space is limited or constrained
- cut to size – can be easily integrated into assembly processes
For further information about our thermally conductive interfaces, please contact our sales team!