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THERMALLY CONDUCTIVE INTERFACES: our adhesive solutions for effective thermal management
Although our silicone thermal pads (TSI) and acrylic thermal adhesive tapes (HTP) ensure effective heat dissipation for your electronic components whilst providing excellent electrical insulation, they are nevertheless designed to meet a wide range of needs and applications.
Find out how to choose the ideal thermally conductive interfaces for your engineering challenges.
TSI thermal pads: flexibility and tolerance management
Placed between the electronic component and the heat sink, the silicone thermal pad ensures optimal heat transfer.
When use them? Ideal for irregular surfaces, when subsequent dismantling is required, or when managing mechanical tolerances is critical.
Key benefits:
- compressible & conformable (softer to compensate for the difference in thickness)
- ensures heat dissipation & improves thermal contact
- no mechanical fastening; secured by external pressure (screws, housing, clips, campling frame)
- high-temperature resistance (up to 200°C)
HTP acrylic thermal tapes: mechanical bonding
The thermal adhesive tapes in our HTP line combine thermal conductivity with a permanent mechanical bond.
When use them? They are particularly suitable when space is limited, a durable bond is required, and high vibration levels may occur.
Key benefits:
- ensures mechanical fastening (eliminates the need for screws or clamping system)
- ideal solution where space is limited or constrained
- heat resistance
- more economical
For further information about our thermally conductive interfaces, please contact our sales team!